Aoshikang Group Co.Ltd.

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network backboard layer-10
Specification: Network backboard Layer-10
Detail: Layer-10 Thichness:2.0mm Min.Hole Dia:0.25mm Min.Width/***ce:6/6mil Finsish:HAL APPlied:Network backboard

layer-10
Specification: Terminal Server Layer-10
Detail: Layer-10 Thichness:2.0mm Min.Hole Dia:0.2mm Min.Width/***ce:5/5mil Finsish:HAL LF APPlied:Terminal Server

bluetooth-sound box layer-10
Specification: Bluetooth-sound box Layer-10
Detail: Layer-10 Thichness:1.2mm Min.Hole Dia:0.1mm Min.Width/***ce:3/3mil Finsish:Immersion Gold APPlied: Bluetooth-sound box

pcb layer 8
Specification: Photoelectricity layer 8
Detail: Layer-8 Thichness:2.0mm Min.Hole Dia:0.2mm Min.Width/***ce:4/4mil Finsish:Immersion Gold APPlied: Photoelectricity

network backboard layer-8
Specification: Network backboard Layer-8
Detail: Layer-8 Thichness:1.6mm Min.Hole Dia:0.2mm Min.Width/***ce:6/6mil Finsish:Immersion Gold APPlied:Network backboard

layer-6
Specification: Main boards of Mobile Layer-6
Detail: Layer-6 Thichness:1.1mm Min.Hole Dia:0.1mm Min.Width/***ce:3/3mil Finsish:Immersion Gold&OSP APPlied:Main boards of Mobile

pcb layer-6
Specification: communications setting Layer-6
Detail: Layer-6 Thichness:1.6mm Min.Hole Dia:0.25mm Min.Width/***ce:5/5mil Finsish:HAL LF APPlied:communications setting

layer-6
Specification: Monitor Layer-6
Detail: Layer-6 Thichness:1.6mm Min.Hole Dia:0.2mm Min.Width/***ce:4/4mil Finsish:Immersion Gold APPlied: for Monitor

layer-4
Specification: DVB-Layer-4
Detail: Layer-4 Thichness: 1.6mm Min.Hole Dia: 0.25mm Min.Width/***ce: 5/5mil Finsish: HAL LeadFree APPlied: for DVB

tft-lcd pcb-4 layer
Specification: TFT-LCD PCB
Detail: Layer-4 Thichness: 0.8mm Min.Hole Dia: 0.25mm Min.Width/***ce: 3.5/3.5mil Finsish: Immersion Gold APPlied: for TFT-LCD


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